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Related Fields             Related Equipment Application



@FPD
@related
 LCD
 PDP
 Digital signage
 Electronic paper
 OLED,and others
¡COG bonder
¡FOG bonder
¡PCB bonder
¡ACF particle measurement
¡Resin dispensing & curing
¡Electrode cleaning
CG-730
FG-730


RI-4000A
ESmartphone, cellular phone
ETablet PC
EUltra PC, PC
ETV, 3DE4K display
EHigh-resolution display for medical use
ESupersized display
EDigital signage
EView finder (EVF, LCOS)



@Energy
@related
 Secondary battery
 LiB (Lithium-ion Battery)
 Solar battery, and others


¡Ultrasonic bonder
¡Wind-around & cell pressing
¡Power collector wiring
¡Isolation film wind-up
¡Can inserter
¡LiB dimension & thickness
@ measurement
¡LiB sorter
EPower collector wiring & can sealing
@LiB integrated line
EElectrode ultrasonic bonding
ELiB drying oven system
EVarious conveyor for LiB
EFilm lamination
ESolar battery lead wiring
EEVA sheet sealing



@Lighting
@related
 LED lighting
 Organic EL lighting



¡Flip chip bonder (FCB)
¡Dispensing equipment
¡FOG bonder for organic EL
¡Electrode bonding
¡Optical film (fluorescent) lamination
¡Die bonder
¡Sealing equipment
¡Slitter
¡LED characteristic inspection
UD-5000 ELED package assembling
ELED flip chip bonding
ELED fluorescent dispensing
ELED film lamination
EStraight typed LED module assembling
EOrganic EL lighting encapsulation
EOrganic EL lighting module assembling
EOptical film lamination




@Sensor
@device
@related
 Image sensor package
 Camera module
 IC card
 RFID tag
 MEMS
 Medical sensor
 Touch panel,and others




¡Flip chip bonder (FCB)
¡COF bonder
¡Micro pressurizing bonder
¡Trimming equipment
¡Die bonder
¡Camera module assembling
¡Cleaning equipment
¡ILB bonder
¡Tiling equipment
¡Glass coupling equipment
¡UV laminating equipment
¡Laser marking equipment
F3
UD-5000
MP-100
EModule assembling for high class camera
@imaging device
EModule assembling for general class
@camera imaging device
EDirect bonding of imaging device onto
@print board
ECOC bonding of imaging device
EChip bonding for IC card
EFilm lamination & collation for IC card
EHigh speed flip chip bonding for RFID
ETouch panel lamination & assembling
EMEMS sensor packaging
ERoll to roll, Sheet to sheet assembling
EDust-free (Clean environmentalization)
EStressless bonding (US, Eutectic, others)

@High
@function
@device
@related
 COCECOWECOOEWLP
 Optical communication module
 Power device,and others

¡Flip chip bonder (FCB)
¡Die bonder
¡Ball bump flattener (coining)
¡Wafer coupling equipment
¡Optical axis alignment equipment
M@P-1000

RF-50
ESiP (System in Package) /MCP(Multi
@Chip Module)
EChip Stacking, Package Stacking
EHigh-integrated 3D package
EOptical parts alignment & bonding
EHigh accuracy bonder for laser diode
EHigh melting point soldering for power
@device



@Others
 Various tester / checker
 Other semiconductor related
@equipment

¡Ball bump inspection
¡Lead frame inspection
¡Fine foreign particle inspection
¡Wire bond inspection
¡Characteristic inspection
¡Insulation inspection
¡Visual inspection
¡Other custom-made equipment
EHigh performance image processing
EDefect inspection of high-density
@mounting board
EMultiple ball bump junction test
EOptical property test by using
@reflector
E6 axes active alignment
EVarious inspection for LiB
EAssembly & test system
FPD
PDP
OLED
COG
FOG
PCB
ACF
FFlat Panel Display
FPlasma Display Panel
FOrganic Light Emitting Display
FChip On Glass
FFlexible printed circuit On Glass
FPrinted Circuit Board
FAnisotropic Conductive Film
EVF
LCOS
LiB
EVA
EL
RFID
MEMS
FElectronic View Finder
FLiguid Crystal On Silicon
FLithium ion Battery
FEthylene Vinyl Acetate copolymer
FElectro Luminescence
FRadio Frequency Identification
FMicro Electro Mechanical Systems
COF
ILB
COC
COW
COO
WLP
FChip On Film
FInter Lead Bonding
FChip On Chip
FChip On Wafer
FChip On Organic
FWafer Level Package